Taiwan – Europe Chip Innovation Forum

Nov. 27-28, 2025.
Shaping the Future of Semiconductors through Technology, Talent, and Collaboration.

Cultivating global talent for the future of semiconductors.

As semiconductor technologies continue to evolve and reshape the global landscape, Taiwan–Europe collaboration has become a key driver of innovation. Hosted by National Institutes of Applied Research (NIAR), imec, Europractice, and TU Dresden (TUD), the Taiwan–Europe Chip Innovation Forum 2025 focuses on Technology Innovation, Talent Cultivation, and Cross-regional Collaboration, bringing together leaders from industry, academia, and policy to explore the future of chip technologies.

Featuring keynote presentations by ESMC and Synopsys, the forum covers Advanced Packaging, Silicon Photonics, Smart Sensing, Advanced Devices, and Emerging Memory, while placing a strong emphasis on developing semiconductor talent, showcasing a comprehensive approach from technology to workforce. By fostering knowledge sharing and partnerships, the forum serves as a vital platform for sustainable semiconductor innovation and talent cultivation worldwide.

Exploring Future Innovations and Taiwan–Europe Collaborations

Nov. 27, Day 1

Day 1 of the Forum will feature NIAR, imec, Europractice, and TU Dresden (TUD) introducing their experience and programs supporting industries and academia. Keynote presentations by ESMC and Synopsys will showcase innovations across the semiconductor value chain. Two technical sessions—Advanced Package and Silicon Photonics—will highlight cutting-edge developments and practical applications in these fields.

Driving Innovation and Talent Development in IC Design

Nov. 28, Day 2

Day 2 of the Forum will focus on driving the IC industry forward through several core topics, exploring key innovations and technical challenges. Smart Sensing and Advanced Device & Emerging Memory sessions will provide in-depth technical discussions, while talent-focused sessions—Semiconductor Talent Cultivation and Infrastructure, City and Chip Talent—will highlight workforce development and industry-academia collaboration. This combination of specialized technical and talent sessions offers participants a platform for interdisciplinary exchange, broadening perspectives and fostering future innovation in the IC industry.