Agenda

DAY 1 Program

The Forum will feature focused sessions on Industry, Institute and University, Advanced Packaging, and Silicon Photonics. Leading companies, research institutes, and universities from Taiwan and Europe will share their expertise, latest innovations, and collaborative projects. Each session offers attendees the chance to explore emerging technologies, understand industry trends, and connect with experts shaping the future of semiconductors and photonics.

Nov. 27 (Thu.)

08:30~09:30
Registration / Welcome Coffee / Networking
09:00 ~ 09:15
Opening Remarks
NIAR
Ursula M. Staudinger/ Rector/ TUD
Romano Hoofman/ imec Strategic Development Director, Europractice GM
09:15 ~ 10:15
Industry session
(Chair: Chien-Nan Liu/ Director General/ TSRI)
ESMC – a light house project of the European chips act in Silicon Saxony
‍ – Christian Koitzsch/ President/ ESMC
The Power  of Photonic ICs in Next Gen Datacenters
‍ – Sander Roosendaal/ R&D Engineering Director/ Synopsys
10:15 ~ 10:30
Coffee Break
10:30 ~ 12:30
Institute and University session
(Chair: Tuo-Hung Hou/ Professor/ NYCU)
NIAR
Chien-Nan Liu/ Director General/ TSRI, NIAR
Europractice  and Beyond: Empowering Europe's Semiconductor Innovation under the Chips Act
‍ – Romano Hoofman/  imec Strategic Development Director, Europractice GM
Ronald Tetzlaff/ Professor/ TUD
12:30 ~ 13:30
Lunch
13:30 ~ 16:00
Advanced Package Session
(Chair: Hann-Huei Tsai/ Deputy Director General/ TSRI, NIAR)
Interconnect  Technologies for Fine-Pitch Chiplet-to-Wafer Bonding
‍ – Juliana Panchenko/ Professor/ TUD
TSRI 2.5D-3DHeterogeneous Integration Platform and Demonstration Showcase
‍ – Hsin-Hao Liao/ TSRI, NIAR
Packaging and Gate Driver Considerations for Intelligent Power Modules
‍ – Wai Tung Ng/ Professor /UofT
From Silicon to Wide Bandgap: The Future of Power Semiconductor Devices
– Marina Antoniou/ Professor/ University of Warwick
Hardware-Based PUF Platform for Cybersecurity Compliance in Industrial IoT Nodes
– Lih-Yih Chiou/ Professor/ NCKU
Edge AI at the Memory Boundary: Near-Memory RISC-V Multi-Core Computing in 7nm
‍– Hussam Amrouch/ Professor/ TUM
16:00 ~ 16:20
Coffee Break
16:20 ~ 18:00
Silicon Photonics Session
(Chair: Hann-Huei Tsai/ Deputy Director General/ TSRI, NIAR)
Organic semiconductors for detectors and bioelectronics
– Karl Leo/ Professor/ TUD
Advancing Silicon Photonics and Co-Packaged Optics Integration
– Ming-Wei Lin/ TSRI, NIAR
Reshaping the Gyro: Silicon Photonics for Tactical-Grade at Consumer Cost
– Yung-Jr Hung/ Professor/ NSYSU
Opportunities for Micro- and Nanostructured Diamond in Photonics
– Niels Quack/ Professor/ Institute for Microelectronics Stuttgart
19:00 ~ 21:00
Dinner

DAY 2 Program

The Forum will bring together experts and industry leaders in Smart Sensing, Advanced Devices and Emerging Memory, Semiconductor Talent Cultivation, Infrastructure, City and Chip Talent, and JRC and ACDRC sessions. Participants will gain first-hand insights from top companies and research institutions in Taiwan and Europe, covering innovation, technology trends, and practical applications. Each session is designed to foster collaboration, share experiences, and explore future opportunities for industry development and talent growth across the semiconductor ecosystem.

Nov. 28 (Fri.)

08:30 ~ 09:30
Registration / Welcome Coffee / Networking
9:00 ~ 11:30
Smart Sensing Session
(Chair: Ying-Zong Juang/ Deputy Director General/ TSRI, NIAR)
AI-PoweredNeuromorphic Electronic Devices for Medical Diagnostics
‍– Gianaurelio Cuniberti/ Professor/ TUD
TSRI MEMS Design & Verification Platform:  Powering the Smart Sensing SIG
‍– Sheng-Hsiang Tseng/ TSRI, NIAR
Cross-Border Innovation and Collaboration: CMOS-MEMS Meets Inkjet Printing Technology in Environment Sensors Development
‍– Wei-Leun Fang/ Professor/ NTHU
An Electret Technology for CMOS-MEMS Devices
‍– Daisuke Yamane/ Professor/ Ritsumeikan University
Crossing Borders in CMOS-MEMS Research: My Experience in Taiwan–Japan Collaboration
– Ming-Huang Li/ Professor/ NTHU
Vladimír Janíček/ Professor/ CTU
Advanced Device and Emerging Memory Session
(Chair: Chih-Chao Yang/ TSRI, NIAR)
imec’s  Technology Roadmap with Respect to Lithography, Logic, and Memory, Leading to  the Era of CMOS 2.0
– Yasser Sherazi/ imec
Nanosheets/CFET and Beyond
– Chee-Wee Liu/ Professor/ NTU
Synthetic  2D Electronics
– Xin liang Feng/ Professor/ TUD
Toward Monolithic 3D Integration of 2D Semiconductors
– Po-Wen Chiu/ Professor/ NTHU
Thomas Kämpfe/ Professor/ Fraunhoferipms
Intelligent Memory Devices and Systems in Sustainable Computing
– Tuo-Hung Hou/ Professor/ NYCU
11:30 ~ 13:00
Lunch
13:00 ~ 15:15
Semiconductor Talent Cultivation Session
(Chair: Chi-Shi Chen/ TSRI, NIAR)
Glavine Yeh/ TSMC
TSRI FinFET IC Design Talent Cultivation: Technical Courses on ADFP
– Ju-Rong Sha/ TSRI, NIAR
IC Talent Cultivation in the AI Era
– Yung Wuu/ SiCADA
Imec as a catalyst for semiconductor talent in Europe and beyond  
– Ruxandra Florea/ imec
Hussam Amrouch/ Professor/ TUM
Panel discussion
15:15 ~ 15:30
Coffee Break
15:30 ~ 17:30
Infrastructure, City and Chip Talent session
University-Industry Kinship, Boundary Organization and the Socio-material Network of Chip Talent Training in Taiwan
– Sharon TH Ku/ Professor/ NYCU
Discussants: Frank Bösenberg/ SiliconSaxony e.V.
‍
Knowledge City and Mobile Talents? Mapping Silicon Saxony's Opportunity Space
– Xiaxue Gao/ Senior Researcher/ Leibniz IOER
Discussants: Melanie Humann/ Professor/ TUD

City Infrastructures and Talent Retention: Survey Discussion
Landscape Transformation in the Light of Large Industrial Estates
– Wolfgang Wende/ Professor/ Leibniz IOER
‍
Housing  and Infrastructure provision in harmony with green building policies in the  context of large-scale industrial settlements in Germany – reflections from a  resource perspective
– Georg Schiller/ Professor/ Leibniz IOER
‍
Discussants: Stephan Kühn/ Mayor/ City of Dresden , Matthias Lerm/ City of Dresden, Melanie Humann/ Professor/ TUD, Peter Rosenbaum/ Head of International Office/ TUD
Panel discussion
‍
17:30 ~ 18:30
JRC and ACDRC session
(Chair: Ying-Zong Juang/ Deputy Director General/ TSRI, NIAR)
JRC and ACDRC introduction
– Radek Holý/ Professor/ CTU
AI and Optimization for Electronic Design Automation(EDA)
– Jiří Jakovenko/ CTU, Dalibor Barri/ STMicroelectronics
Hardware Security Technology Development and Promotion Program
– Jiří Háze/ BUT
Micro-fluxgate with racetrack core and solenoid coils
‍– J.Maier, P. Chen, P. Ripka
SecureIoT Platform with Advanced Key Generation and Robust Cybersecurity
– Lih-Yih Chiou/ Professor/ NCKU, Radek Holý/ Professor/ CTU
‍
18:30 ~ 18:40
Closing Remarks
Contact
tsri-ica@niar.org.tw
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